A wafer chuck’s job is to hold a 300mm disc flat to a fraction of its own thickness, so the plate under it has to be flatter than the flatness spec it’s enforcing. We face and grind this in the same fixture orientation the part sees in service, rather than flipping it between operations, because releasing and re-clamping a thin plate is enough to let it relax out of flat.
Part
Semiconductor Chuck Plate
An electrostatic-chuck carrier plate — flatness across the whole clamping face matters more here than any single linear dimension.
Part
Semiconductor Chuck Plate
Rev
Rev E
Year
2026
Material
6061-T6 aluminium, hard-anodized
Tightest tolerance
±0.01mm (10 µm) flatness across face
Lot
12-off, running lot
Lead time
20 days
Route sheet
How this part actually got made.
| Op | Stage | Machine | Tool | Result |
|---|---|---|---|---|
| 01 | Stock | Material stores | — | Saw-cut billet, certificate matched to the traveler. |
| 02 | Face | Haas VF-2, 3-axis vertical mill | Ø12mm ball-nose, 2-flute carbide | Rz ≈ 190.52 µm |
| 03 | Haas VF-2, 3-axis vertical mill | Ø8mm ball-nose, 2-flute carbide | Rz ≈ 127.02 µm | |
| 04 | Drill | Haas VF-2, 3-axis vertical mill | Ø6mm jobber drill, HSCO | — |
| 05 | Grind | Studer S31, cylindrical grinder | Ø8mm ball-form CBN wheel | Rz ≈ 2.81 µm |
| 06 | Inspect | Zeiss Contura CMM | — | First-article report against the drawing's GD&T callouts. |
Finish
Specified surface finish.
What the drawing calls out — verified on receipt with a profilometer, not assumed from the tool that made it.
Ra0.40 µm